| Surface Additives (Micro PMU-Pastes) |
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Overview of Finest Grinded Polymethylurea-Pastes
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Product
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Solvent / (Reactive Thinner)
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Solid Content
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d50
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d99
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Remarks
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DEUTERON OG 861
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Shellsol A 150 ND
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ca. 32%
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3,5
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12,0
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solvent based systems
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DEUTERON OG 8612
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Shellsol A 150 ND
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ca. 32%
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2,3
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7,0
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solvent based systems
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DEUTERON OG 8614
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Shellsol A 150 ND
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ca. 32%
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< 1,5
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< 3,5
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solvent based systems
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DEUTERON OG 863
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2-Propanol
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ca. 32%
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3,5
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12,5
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waterborne systems
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DEUTERON OG 8632
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2-Propanol
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ca. 32%
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2,3
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7,0
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waterborne systems
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DEUTERON OG 8634
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2-Propanol
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ca. 32%
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< 1,5
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< 3,5
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waterborne systems
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DEUTERON OG 8650
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Butyl acetate
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ca. 30%
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3,5
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12,5
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solvent based systems
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DEUTERON OG 8652
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Butyl acetate
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ca. 30%
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2,3
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7,0
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solvent based systems
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DEUTERON OG 8654
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Butyl acetate
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ca. 30%
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< 1,5
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< 3,5
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solvent based systems
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DEUTERON OG 8670
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Water
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ca. 22%
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3,5
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12,5
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waterborne systems
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DEUTERON OG 8672
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Water
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ca. 22%
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2,8
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8,0
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waterborne systems
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DEUTERON OG 8674
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Water
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ca. 22%
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< 2,0
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< 5,0
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waterborne systems
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DEUTERON OG 8803
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DPGDA
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ca. 30%
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3,5
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12,0
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radic. UV-Systems
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DEUTERON OG 8805
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DPGDA
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ca. 30%
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2,8
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8,0
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radic. UV-Systems
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DEUTERON OG 8807
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DPGDA
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ca. 30%
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< 2,5
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< 7,0
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radic. UV-Systems
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DEUTERON OG 8810
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GPTA
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ca. 30%
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3,5
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12,0
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radic. UV-Systems
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DEUTERON OG 8812
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GPTA
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ca. 30%
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2,8
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8,0
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radic. UV-Systems
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DEUTERON OG 8814
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GPTA
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ca. 30%
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< 2,5
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< 7,0
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radic. UV-Systems
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DEUTERON OG 8820
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TMPEOTA
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ca. 30%
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3,5
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12,0
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radic. UV-Systems
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DEUTERON OG 8822
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TMPEOTA
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ca. 30%
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2,8
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8,0
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radic. UV-Systems
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DEUTERON OG 8824
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TMPEOTA
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ca. 30%
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< 2,5
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< 7,0
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radic. UV-Systems
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 Download table (pdf)
All values are based on average analysis and are therefore only approximate values. These values are not always a component of the respective specifications.
Note: Particle size analysis: Methods MWM 29; APM - 31 (house method), dimension: µm
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Brochure "Surface Additives based on Micro PMU Pastes" |
Brochure "Surface Additives based on Micro PMU Pastes" : download (3,0 Mb pdf)
If you want this brochure in paper form please click on button "order sample".
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Additifs de surface basés sur des pâtes de PMU micronisées |
 Brochure "Additifs de surface basés sur des pâtes de PMU micronisées" : download (3,0 Mb pdf) 
If you want this brochure in paper form please click on button "order sample".
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DEUTERON OG 861 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of can-coatings and coil-coating-systems. Past-like preparation in Shellsol A 150 ND.
Particle size: d50: 3,5 µm d99: 12,0 µm
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DEUTERON OG 8612 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of can-coatings and coil-coating-systems. Past-like preparation in Shellsol A 150 ND.
Particle size: d50: 2,3 µm d99: 7,0 µm
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DEUTERON OG 8614 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of can-coatings and coil-coating-systems. Past-like preparation in Shellsol A 150 ND.
Particle size: d50: <1,5 µm d99: <3,5 µm
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DEUTERON OG 863 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of printing-inks. Past-like preparation in Isopropanol.
Particle size: d50: 3,5 µm d99: 12,5 µm
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DEUTERON OG 8632 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of printing-inks. Past-like preparation in Isopropanol.
Particle size: d50: 2,3 µm d99: 7,0 µm
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DEUTERON OG 8634 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of printing-inks. Past-like preparation in Isopropanol.
Particle size: d50: < 1,5 µm d99: < 3,5 µm
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DEUTERON OG 8650 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of printing-inks. Past-like preparation in butyl acetate.
Particle size: d50: 3,5 µm d99: 12,5 µm
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DEUTERON OG 8652 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of printing-inks. Past-like preparation in butyl acetate.
Particle size: d50: 2,3 µm d99: 7,0 µm
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DEUTERON OG 8654 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of printing-inks. Past-like preparation in butyl acetate.
Particle size: d50: < 1,5 µm d99: < 3,5 µm
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DEUTERON OG 8670 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of water borne systems, particulary printing-inks. Past-like preparation in water.
Particle size: d50: 3,5 µm d99: 12,5 µm
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DEUTERON OG 8672 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of water borne systems, particulary printing-inks. Past-like preparation in water.
Particle size: d50: 2,8 µm d99: 8,0 µm
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DEUTERON OG 8674 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip, mechanical resistance and processibility of water borne systems, particulary printing-inks. Past-like preparation in water.
Particle size: d50: < 2,0 µm d99: < 5,0 µm
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DEUTERON OG 8803 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of UV-curing systems. Past-like preparation in DPGDA.
Particle size: d50: 3,5 µm d99: 12,0 µm
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DEUTERON OG 8805 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of UV-curing systems. Past-like preparation in DPGDA.
Particle size: d50: 2,8 µm d99: 8,0 µm
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DEUTERON OG 8807 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of UV-curing systems. Past-like preparation in DPGDA.
Particle size: d50: < 2,5 µm d99: < 7,0 µm
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DEUTERON OG 8810 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of UV-curing systems. Past-like preparation in GPTA.
Particle size: d50: 3,5 µm d99: 12,0 µm
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DEUTERON OG 8812 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of UV-curing systems. Past-like preparation in GPTA.
Particle size: d50: 2,8 µm d99: 8,0 µm
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DEUTERON OG 8814 |
finest grinding of non thermoplastic polycondensation resin (free of wax and silicone) to improve slip and mechanical resistance of UV-curing systems. Past-like preparation in GPTA.
Particle size: d50: < 2,5 µm d99: < 7,0 µm
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